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Jobs or company...

Senior Mechanical Engineer

$ 4,000 - $ 6,000 / month
Original
Simplified

Job Description

  • Perform mechanical & thermal analysis and characterization of advanced IC packages
  • Build up new mechanical & thermal capabilities with latest simulation and characterization technologies
  • Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
  • Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
  • Conduct IC packaging technology development together with other teams
  • Carry out mechanical, thermal and reliability test and correlate with mechanical & thermal simulation for validation

Requirements

  • Degree / Master in Mechanical Engineering or related field
  • Solid knowledge on FEM & mechanics of material
  • Mechanical modeling experience for IC package’s stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must
  • Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
  • Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
  • Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable
  • Team player with good interpersonal and communication skills
  • Keen for R&D activities in IC packaging technology development, package’s mechanical & thermal analysis/ design/ optimization/ characterization
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