Process Integration Module Engineer

As a Process Integration Module Engineer in the Process Integration department, you will be responsible for coordinating improvements in Yield, Quality, and Output for the NAND Flash production line. Day-to-day responsibilities include but not limit to crafting and analyzing process experiments, teaming with YE and PQA to investigate yield and quality problems, and working with production and process engineering teams to ensure the smooth operation of the fab.

Responsibilities and Tasks

• Collaborate with multi-functional teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop.
• Communicate module related issues to the Fab engineering and leadership teams.
• Design, execute, and analyze experiments to improve fab process, yield, and quality.
• Collect and interpret complex data to optimize Fab processes and increase yields.
• Engage and/or lead cross-area engineering teams to tackle process issues.
• Work closely with global partners to stay ahead of on module related topics and process alignment projects.
• Collaborate with other PI module owners and sister fabs to drive business process alignment
• Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues

Requirements:
• Bachelor's degree or equivalent experience in Electrical & Electronics, Materials Engineering, Material Science, Physics or equivalent.
• Problem-solving attitude with a drive for finding effective solutions.
• Passion and interest in semiconductor frontend fabrication and memory industry.
• Strong interpersonal skills (written, verbal and presentation).
• Strong personal initiative and ability to work in a fast-paced and dynamic environment.
• Able to work on 5 days off-shift.

• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus

Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

As a Process Integration Module Engineer in the Process Integration department, you will be responsible for coordinating improvements in Yield, Quality, and Output for the NAND Flash production line. Day-to-day responsibilities include but not limit to crafting and analyzing process experiments, teaming with YE and PQA to investigate yield and quality problems, and working with production and process engineering teams to ensure the smooth operation of the fab.

Responsibilities and Tasks

• Collaborate with multi-functional teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop.
• Communicate module related issues to the Fab engineering and leadership teams.
• Design, execute, and analyze experiments to improve fab process, yield, and quality.
• Collect and interpret complex data to optimize Fab processes and increase yields.
• Engage and/or lead cross-area engineering teams to tackle process issues.
• Work closely with global partners to stay ahead of on module related topics and process alignment projects.
• Collaborate with other PI module owners and sister fabs to drive business process alignment
• Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues

Requirements:
• Bachelor's degree or equivalent experience in Electrical & Electronics, Materials Engineering, Material Science, Physics or equivalent.
• Problem-solving attitude with a drive for finding effective solutions.
• Passion and interest in semiconductor frontend fabrication and memory industry.
• Strong interpersonal skills (written, verbal and presentation).
• Strong personal initiative and ability to work in a fast-paced and dynamic environment.
• Able to work on 5 days off-shift.

• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus

Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.