Intern, Mechanical Design
- Internship, onsite
- STMicroelectronics
- Singapore, Singapore
Salary undisclosed
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OUR STORY
At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
YOUR ROLE
The Mechanical Design Engineer role involves the design of integrated circuit packaging suitable for use in Time of Flight (TOF) system. The packaging forms an integral part of the optical component integration and thermal management of the module.
It will require detailed mechanical design using CAD software (Solidworks) to explore concept designs, develop mass production designs optimized for external subcontractors manufacturing process tolerances.
Role
The role will involve mechanical design for optical sensors, with the objective to produce well designed modules for mass production, including:
The design stage the internship takes depends on the stages of the assigned project as well as the point the person joins. The internship may not see the start or completion of the project undertaken. However, the internship would provide a good insight of how a large volume project is being carried out and the various aspect of a package design engineer.
Your Skills & Experiences
To discover more, visit st.com/careers
At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
YOUR ROLE
The Mechanical Design Engineer role involves the design of integrated circuit packaging suitable for use in Time of Flight (TOF) system. The packaging forms an integral part of the optical component integration and thermal management of the module.
It will require detailed mechanical design using CAD software (Solidworks) to explore concept designs, develop mass production designs optimized for external subcontractors manufacturing process tolerances.
Role
The role will involve mechanical design for optical sensors, with the objective to produce well designed modules for mass production, including:
- Responsible for mechanical package design for consumer electronics applications
- Knowledge of FMEA lead design processes
- Material and process selection
- Detailed 2D drawings and 3D modelling
- Knowledge of Finite Element Analysis for stress and thermal modelling
- Co-operation with related disciplines including optical & product engineers
- Design for high volume manufacture, assembly compatibility
- Verifying mechanical design by simulation and characterization of parts
The design stage the internship takes depends on the stages of the assigned project as well as the point the person joins. The internship may not see the start or completion of the project undertaken. However, the internship would provide a good insight of how a large volume project is being carried out and the various aspect of a package design engineer.
Your Skills & Experiences
- Undergraduate training, working towards B.Eng in mechanical engineering
- Proficiency in Solidworks
- Design Engineering processes
- GD&T, Tolerance analysis
- Strong communication skills both written and oral
- Good interpersonal and Presentation skills
- Injection molding
- Mechanical and thermal simulation
- Solid Mechanics
To discover more, visit st.com/careers
OUR STORY
At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
YOUR ROLE
The Mechanical Design Engineer role involves the design of integrated circuit packaging suitable for use in Time of Flight (TOF) system. The packaging forms an integral part of the optical component integration and thermal management of the module.
It will require detailed mechanical design using CAD software (Solidworks) to explore concept designs, develop mass production designs optimized for external subcontractors manufacturing process tolerances.
Role
The role will involve mechanical design for optical sensors, with the objective to produce well designed modules for mass production, including:
The design stage the internship takes depends on the stages of the assigned project as well as the point the person joins. The internship may not see the start or completion of the project undertaken. However, the internship would provide a good insight of how a large volume project is being carried out and the various aspect of a package design engineer.
Your Skills & Experiences
To discover more, visit st.com/careers
At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
YOUR ROLE
The Mechanical Design Engineer role involves the design of integrated circuit packaging suitable for use in Time of Flight (TOF) system. The packaging forms an integral part of the optical component integration and thermal management of the module.
It will require detailed mechanical design using CAD software (Solidworks) to explore concept designs, develop mass production designs optimized for external subcontractors manufacturing process tolerances.
Role
The role will involve mechanical design for optical sensors, with the objective to produce well designed modules for mass production, including:
- Responsible for mechanical package design for consumer electronics applications
- Knowledge of FMEA lead design processes
- Material and process selection
- Detailed 2D drawings and 3D modelling
- Knowledge of Finite Element Analysis for stress and thermal modelling
- Co-operation with related disciplines including optical & product engineers
- Design for high volume manufacture, assembly compatibility
- Verifying mechanical design by simulation and characterization of parts
The design stage the internship takes depends on the stages of the assigned project as well as the point the person joins. The internship may not see the start or completion of the project undertaken. However, the internship would provide a good insight of how a large volume project is being carried out and the various aspect of a package design engineer.
Your Skills & Experiences
- Undergraduate training, working towards B.Eng in mechanical engineering
- Proficiency in Solidworks
- Design Engineering processes
- GD&T, Tolerance analysis
- Strong communication skills both written and oral
- Good interpersonal and Presentation skills
- Injection molding
- Mechanical and thermal simulation
- Solid Mechanics
To discover more, visit st.com/careers