Package Development Engineering Metro Real-time Defect Analysis (MRDA) Process & Equipment Senior Engineer
Salary undisclosed
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- Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
- Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
- Work with equipment suppliers to develop new capability, algorithms and capabilities to meet the package development requirements
- Actively participate in Package Development Engineering activities
- Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
- Create decision matrix for equipment and material selection
- Generates and set-up ADC, set-up/improve recipes
- Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators
- Innovate and improve the existing solution by integrating advance AI solution such as deep learning or segmentation approach
- Work with IOT team or equipment suppliers to extract any tool images, define the necessary data format and develop pipeline to integrate to Micron system for new application as process monitoring
- Plan/submit capital request to acquire new Equipment
- Create purchasing specification (Doc2) document
- Establish the new equipment qualification criteria and activities roadmap with respective functional team
- Establish project handover requirements and procedures upon machine qualification
- Prepare documentation for handing over with respective site owner
- Conduct data gathering for low volume production
- Conduct training for Site representatives/personnel
- Establish the feedback loop for Continuous Improvement after mass volume production
- Maintain and regularly update the TOR, with inputs from local or other assembly site
- Maintain general knowledge of process and material characteristics and translate to equipment design requirement
- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need
- Maintain knowledge of design constraints and weakness of existing platform
- Participate in the continuous improvement projects involving equipment improvement and upgrades
- Bachelor's or master’s degree in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
- 4 or more years of experience in Semiconductor Manufacturing with proven track record of technical leadership in semiconductor manufacturing, preferably in MRDA Process & Equipment Engineering. Experience in other Front-End areas, in PWF & HBM technology is of greater advantage.
- Be able to comfortably work across organizational boundaries and geographies.
- Ability to effectively collaborate with cross-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
- Demonstrated ability to drive and execute a wide range of global initiatives with global teams.
- Organized, detail-oriented, and strong focus on results.
- Demonstrated ability to inspire teamwork and to effectively lead others.
- Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
- Excellent analytical skills and organizational competency
- With good oral and written English communication skill
- Relevant experience in CSAM/XRAY/Acoustic tool will be added advantage
- Knowledge of Python, Power Bi, Deep Learning are required to be able to manage the metrology data to innovate solutions to support package development
- Preferred Company: KLA, ONTO, CAMTEK, SAMSUNG, HYNIX, INTEL
- Preferred Skillset: Frontend Fabrication Experience, Metrology and/or Inspection Experience
- Preferred Language: English Speaking
- Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
- Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
- Work with equipment suppliers to develop new capability, algorithms and capabilities to meet the package development requirements
- Actively participate in Package Development Engineering activities
- Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
- Create decision matrix for equipment and material selection
- Generates and set-up ADC, set-up/improve recipes
- Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators
- Innovate and improve the existing solution by integrating advance AI solution such as deep learning or segmentation approach
- Work with IOT team or equipment suppliers to extract any tool images, define the necessary data format and develop pipeline to integrate to Micron system for new application as process monitoring
- Plan/submit capital request to acquire new Equipment
- Create purchasing specification (Doc2) document
- Establish the new equipment qualification criteria and activities roadmap with respective functional team
- Establish project handover requirements and procedures upon machine qualification
- Prepare documentation for handing over with respective site owner
- Conduct data gathering for low volume production
- Conduct training for Site representatives/personnel
- Establish the feedback loop for Continuous Improvement after mass volume production
- Maintain and regularly update the TOR, with inputs from local or other assembly site
- Maintain general knowledge of process and material characteristics and translate to equipment design requirement
- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need
- Maintain knowledge of design constraints and weakness of existing platform
- Participate in the continuous improvement projects involving equipment improvement and upgrades
- Bachelor's or master’s degree in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
- 4 or more years of experience in Semiconductor Manufacturing with proven track record of technical leadership in semiconductor manufacturing, preferably in MRDA Process & Equipment Engineering. Experience in other Front-End areas, in PWF & HBM technology is of greater advantage.
- Be able to comfortably work across organizational boundaries and geographies.
- Ability to effectively collaborate with cross-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
- Demonstrated ability to drive and execute a wide range of global initiatives with global teams.
- Organized, detail-oriented, and strong focus on results.
- Demonstrated ability to inspire teamwork and to effectively lead others.
- Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
- Excellent analytical skills and organizational competency
- With good oral and written English communication skill
- Relevant experience in CSAM/XRAY/Acoustic tool will be added advantage
- Knowledge of Python, Power Bi, Deep Learning are required to be able to manage the metrology data to innovate solutions to support package development
- Preferred Company: KLA, ONTO, CAMTEK, SAMSUNG, HYNIX, INTEL
- Preferred Skillset: Frontend Fabrication Experience, Metrology and/or Inspection Experience
- Preferred Language: English Speaking