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Jobs or company...

Associate Engineer (Wire bonding/Die Attach)

Salary undisclosed
Checking job availability...
Original
Simplified
The Opportunity:Adecco is partnering with a leading technology company specializing in microelectronics assembly and RF MMIC packaging solutions, and we are seeking a Microelectronics Assembly Assistant Engineer to join their dynamic team! The successful candidate will play a key role in supporting prototype and production volumes of RF MMIC assemblies, focusing on hands-on microelectronic assembly and IC packaging processes while collaborating with engineering teams to develop innovative solutions.
  • Full-time, permanent opportunity
  • Location: Northeast, Singapore
  • Work Hours: Monday - Friday, 9am - 6pm
  • Salary: Up to $3,800 + AWS + VB
The Job:
  • Set up and operate microelectronics assembly equipment, including epoxy dispensing, die attach, wire bonding, plasma cleaning, epoxy curing, pull/shear testing, and leak testing.
  • Conduct Design of Experiments (DOEs) to develop and refine assembly processes.
  • Provide input to engineering teams on the producibility of new RF packaging designs.
  • Assist in creating assembly instructions and method sheets for consistent process execution.
  • Identify and troubleshoot equipment and process issues to maintain production efficiency.
  • Collaborate in the development and procurement of specialized tooling and equipment for assembly operations.
  • Perform microelectronics IC device assembly following work instructions, assembly drawings, and specifications.
  • Support engineering efforts to improve assembly yield and device reliability.
  • Ensure all work meets the company's quality standards and deadlines.
The Talent:
  • Diploma/ITE in Electronics or equivalent.
  • At least 5 years of hands-on experience in microelectronic assembly operations.
  • Strong background in epoxy dispense, die attach, and wire bonding (thermo-compression bonding)
  • Experience in executing DOEs with high attention to detail and accurate data recording.
  • Excellent hand-eye coordination with the ability to work under a microscope for extended periods.
  • Strong troubleshooting skills for process and equipment-related issues.
  • Familiarity with RF/Microwave assembly in high-reliability environments, particularly to Mil-Std-883 and Mil-Perf-38534 standards.
  • Proficient in MS Office tools (Word, Excel, PowerPoint, Outlook); experience with 3D CAD software is a plus.
Next Step:
  • Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and your expected package.
  • Apply through this application or send your resume to
in MS Word format. We'd love to hear from you! * We regret that only shortlisted candidates will be notified.Amy Trang NguyenDirect Line: +65 6697 7960
EA License No: 91C2918
Personnel Registration Number: R22104357
The Opportunity:Adecco is partnering with a leading technology company specializing in microelectronics assembly and RF MMIC packaging solutions, and we are seeking a Microelectronics Assembly Assistant Engineer to join their dynamic team! The successful candidate will play a key role in supporting prototype and production volumes of RF MMIC assemblies, focusing on hands-on microelectronic assembly and IC packaging processes while collaborating with engineering teams to develop innovative solutions.
  • Full-time, permanent opportunity
  • Location: Northeast, Singapore
  • Work Hours: Monday - Friday, 9am - 6pm
  • Salary: Up to $3,800 + AWS + VB
The Job:
  • Set up and operate microelectronics assembly equipment, including epoxy dispensing, die attach, wire bonding, plasma cleaning, epoxy curing, pull/shear testing, and leak testing.
  • Conduct Design of Experiments (DOEs) to develop and refine assembly processes.
  • Provide input to engineering teams on the producibility of new RF packaging designs.
  • Assist in creating assembly instructions and method sheets for consistent process execution.
  • Identify and troubleshoot equipment and process issues to maintain production efficiency.
  • Collaborate in the development and procurement of specialized tooling and equipment for assembly operations.
  • Perform microelectronics IC device assembly following work instructions, assembly drawings, and specifications.
  • Support engineering efforts to improve assembly yield and device reliability.
  • Ensure all work meets the company's quality standards and deadlines.
The Talent:
  • Diploma/ITE in Electronics or equivalent.
  • At least 5 years of hands-on experience in microelectronic assembly operations.
  • Strong background in epoxy dispense, die attach, and wire bonding (thermo-compression bonding)
  • Experience in executing DOEs with high attention to detail and accurate data recording.
  • Excellent hand-eye coordination with the ability to work under a microscope for extended periods.
  • Strong troubleshooting skills for process and equipment-related issues.
  • Familiarity with RF/Microwave assembly in high-reliability environments, particularly to Mil-Std-883 and Mil-Perf-38534 standards.
  • Proficient in MS Office tools (Word, Excel, PowerPoint, Outlook); experience with 3D CAD software is a plus.
Next Step:
  • Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and your expected package.
  • Apply through this application or send your resume to
in MS Word format. We'd love to hear from you! * We regret that only shortlisted candidates will be notified.Amy Trang NguyenDirect Line: +65 6697 7960
EA License No: 91C2918
Personnel Registration Number: R22104357