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Front End Central Product Integration (FE cPIE) Senior Manager
Salary undisclosed
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- Lead PI loop uniformity integration projects and programs to address yield and quality challenges, collaborating with cross module process/PI technical experts and suppliers to improve uniformity and optimize bevel/backside processes to achieve BIC yield performance.
- Build Model based root cause analysis and enhance critical inline defense line for both bevel backside and uniformity.
- Maintain and enhance product integration programs or loop domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach. Node over node shift left uniformity, bevel and backside BKM implementation at early development stage to accelerate wafer edge yield and quality ramping.
- Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
- Maintain a strong and open relationship with peer group and managers in other functional areas within MFG and outside organizations such as Fab, TD, PE and GQ.
- Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data. Basic knowledge of probe, parametric, backend and reliability testing will be a plus.
- Good model based problem solving together with data driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device related issues, and address root cause.
- Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to Micron sites as necessary for face to face collaboration.
- Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
- Good multi-tasking, verbal and written communication skills.
- with more than 7 years relevant industries experience / knowledges.
- Bachelors/Masters in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 7 years experience in process related role in semiconductor industry.
- Lead PI loop uniformity integration projects and programs to address yield and quality challenges, collaborating with cross module process/PI technical experts and suppliers to improve uniformity and optimize bevel/backside processes to achieve BIC yield performance.
- Build Model based root cause analysis and enhance critical inline defense line for both bevel backside and uniformity.
- Maintain and enhance product integration programs or loop domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach. Node over node shift left uniformity, bevel and backside BKM implementation at early development stage to accelerate wafer edge yield and quality ramping.
- Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
- Maintain a strong and open relationship with peer group and managers in other functional areas within MFG and outside organizations such as Fab, TD, PE and GQ.
- Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data. Basic knowledge of probe, parametric, backend and reliability testing will be a plus.
- Good model based problem solving together with data driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device related issues, and address root cause.
- Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to Micron sites as necessary for face to face collaboration.
- Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
- Good multi-tasking, verbal and written communication skills.
- with more than 7 years relevant industries experience / knowledges.
- Bachelors/Masters in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 7 years experience in process related role in semiconductor industry.