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NTI Yield Failure Analysis Technician

Salary undisclosed

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Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Required equipment related responsibilities and required documentation:

• Log Equipment to the accurate state using ETI (Equipment tracking interface)

• Troubleshoot and attempt to resolve any equipment problem if possible

• If unable to resolve the issue then Log equipment down in ETI and interact directly with the equipment vendor FSE or the R&M group to resolve

• Sophisticated operational capabilities (including shut down / start up) for all SEM Lab platforms and related support equipment (NSC dry etcher, Manual Wet Hood, Oxford EDS)

Dual Beam operation:

• Can verify Dual Beam is running accurately and have a proven understanding:

beam alignments (ion aperture alignment verification), high/low KV, beam current, SE, lower detector, upper detector (TLD), contamination, sample cleaning

• Can complete typical high quality general and site specific (single bit) Dual Beam Slice and view targeting

o Plane view slice and view (Planar fib movie)

• Basic STEM performance

o High quality, repeatable general location STEM analysis (Bright and Dark Field)

•Intermediate STEM performance

o Specific Bit / Word targeting

o Inverted stem

•Validated capability to improve Ion beam alignments and save setting procedures

• Confirmed capability to perform Ion and Electron Beam voltage contrasting techniques

Required sample prep related knowledge and required documentation:

• Confirmed, reliable etchbacks / deprocessing to all commonly identified Failure Analysis levels on at least one(1) main running part type from Fab 4 R&D (MDM documentation required)

• Explain primary uses for sample specific CMP polish stations regarding PFA

• Explain uses and examples of Dry and Wet Etch delayering regarding PFA and of Ion Polish (Fischione) performance with regard to delayering

• Explain orientation (angle/rotational effects) and goal recognition with respect to Dual Beam sample loading

• Backside de-processing

• 4Wave de-processing

Required Failure Analysis Software Support programs and documentation:

• Cadence (K2 view/Klayout/DF2) file loading and operation to include:

o Confirmed zoom and pan functionality

o Masking layer addition and subtraction

• Klarity file loading and operation to include:

o Inline defect ID collection using optical solutions

o Dual Beam/SEM top down, angle, and x-sec view

• ESDA – Familiarity/recognition of commonly used Electrical Categories on at least one main running part type from Fab 4 R&D as taught by YE part type Engineering

Required Process related knowledge and documentation:

• Finish the process related classes offered by the Micron training department (primarily traveler classes) on all current technologies running in Fab4 (ie) DRAM, NAND, MTX, EM etc. (Micron training verification)

o Complete probe level x-sec with and ION polish and label primary x-sec levels on current assigned (at least one) part type/technology: (Update Document annually)

Customer service (Internal YE Eng) responsibilities:

• Effective and efficient communication with internal part type YE Engineering group including:

o Defect location (Kludge sheet) verification and confirmation

o Topography accuracy

o Failure mechanism verification

o Project (Eng passdown/Workflow) completion verification

Required SEM Lab Responsibilities:

• Finish the required Sem lab samples each shift and required will be determined by the current queue

• In Progress, Held, Fibs, Topdown Fischione will be removed from Total queue to current queue

• If there are a total of 9 sem tech/sem on shift, then no Sem lab will be required for that shift

Education:

ITE or Diploma in an electronics related field or equivalent experience is preferred.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.