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HP Spark Management Associate - Advance Semiconductor Packaging Process Development Engineer

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HP Spark Management Associate - Advance Semiconductor Packaging Process Development Engineer

Description -

HP is committed to nurture our next generation of leaders for tomorrow and promote collaboration across our multi-generational workforce. Under the 15 months SPARK Management Associate Program, you will undergo an accelerated induction experience to fast-track your career in the technology industry. You will learn and appreciate different aspects of the business, within one of our business segments to work in upon graduation.

What a Advance Semiconductor Packaging Process Development Engineer does at HP:

  • You will be a member of a process and development team of engineers working with internal and outsourced manufacturing partners that develops reliable, cost effective and high-quality solutions for our Inkjet Print Supplies.
  • You will have the opportunity to work with very high speed/high precision die attach equipment, wire bonder, chip attach, high precision over mold tool and other semiconductor packaging tools in a high volume manufacturing environment.
  • Oversee key strategic programs, such as Smart Manufacturing and Optimization.
  • Collaborate with the worldwide team on the development roadmap.
  • Participates in concurrent projects on current production, sustainability and New Product Introduction.
  • Innovates, develops and defines improved manufacturing processes through methodical approach and studies.
  • Collaborates and communicates with management, internal, and outsourced development partners regarding project status, progress, and issue resolution.

Individuals who do well in this role at HP, usually possess:

  • Bachelor's or Master's degree in Mechanical, Mechatronic, Manufacturing, Electrical, Electronic, Physics, Material Engineering.
  • Typically, 0-1 years of experience (fresh graduates).
  • Experience or understanding of appropriate engineering design tools and software packages.
  • Good analytical and problem-solving skills.
  • Ability to partner & work independently.
  • Ability to apply engineering fundamentals & concepts.
  • Good analytical and problem-solving skills.
  • Data Analytics, Statistical Process Control (SPC) and CAD.
  • Integrate new designs into existing processes.
  • Ability to work and interact effectively with team members from other disciplines, cultures, organizations.

What’s in it for you:

  • Professional development and career coaching.
  • High visibility projects with leaders.
  • Partner and work with country, regional and worldwide teams.
  • Diverse community and buddy support.
  • Competitive remuneration package.

Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.

HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices in Singapore.

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Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Singapore)

Travel -

Relocation -

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s or your EEO rights as an applicant under the law, please click here: