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Senior Engineering, Package Development Engineering, Key Equipment Group

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Job Description:Our vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. JR68045 Senior Engineering, Package Development Engineering, Key Equipment GroupJob Responsibilities:Identify, select, and evaluate new equipment/ new technology to support current and future requirementsDefine, development and establish new equipment design/ capability requirements aligned to Process and Packaging RoadmapDevelop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirementsWork with equipment suppliers to develop new capabilityEngage in active participation in Package Development Engineering activitiesConducts equipment benchmarking to establish the equipment suppliers and platforms for future needCreate decision matrix for equipment and material selectionEvaluate and qualify new equipment platform and handover to production groupPlan/submit capital request to acquire new EquipmentCreate and owner of purchasing specification (Doc2) documentEstablish the new equipment qualification criteria and activities roadmap with respective functional teamsEstablish project handover requirements and procedures upon machine qualificationPrepare documentation for handing over with respective site ownerConduct data gathering for low volume productionConduct training for Site representativesFeedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projectsMaintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platformDriving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity levelMaintain and regularly update the TOR, with inputs from local or other assembly siteMaintain general knowledge of process and material characteristics and translate to equipment design requirementSearch continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging needEquipment System Readiness, Enablement & EnhancementConduct equipment characterization, identify and enable the critical equipment parameter monitoring systemWorking with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicableEquipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running supportSupplier Management & Engagement ProgramWorking on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefitManage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvementCollaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategiesJob Requirements/ Qualifications:PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience RequiredExperiences in R&D in Front End/ Wafer Bumping / Advanced PackagingBasic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniquesMinimum 3 years’ experience in related semiconductor industry or related manufacturing environmentExperience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technologyUnderstanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plusFast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendorsStrong communication (verbal & written) and presentation skills (English speaking is must)Understanding of business needs and customers’ requirement, able to participate in cross functional team environmentStrong project management skills to ensure execution to timelinesAbout Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations, please contactMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Job Description:Our vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. JR68045 Senior Engineering, Package Development Engineering, Key Equipment GroupJob Responsibilities:Identify, select, and evaluate new equipment/ new technology to support current and future requirementsDefine, development and establish new equipment design/ capability requirements aligned to Process and Packaging RoadmapDevelop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirementsWork with equipment suppliers to develop new capabilityEngage in active participation in Package Development Engineering activitiesConducts equipment benchmarking to establish the equipment suppliers and platforms for future needCreate decision matrix for equipment and material selectionEvaluate and qualify new equipment platform and handover to production groupPlan/submit capital request to acquire new EquipmentCreate and owner of purchasing specification (Doc2) documentEstablish the new equipment qualification criteria and activities roadmap with respective functional teamsEstablish project handover requirements and procedures upon machine qualificationPrepare documentation for handing over with respective site ownerConduct data gathering for low volume productionConduct training for Site representativesFeedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projectsMaintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platformDriving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity levelMaintain and regularly update the TOR, with inputs from local or other assembly siteMaintain general knowledge of process and material characteristics and translate to equipment design requirementSearch continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging needEquipment System Readiness, Enablement & EnhancementConduct equipment characterization, identify and enable the critical equipment parameter monitoring systemWorking with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicableEquipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running supportSupplier Management & Engagement ProgramWorking on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefitManage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvementCollaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategiesJob Requirements/ Qualifications:PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience RequiredExperiences in R&D in Front End/ Wafer Bumping / Advanced PackagingBasic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniquesMinimum 3 years’ experience in related semiconductor industry or related manufacturing environmentExperience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technologyUnderstanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plusFast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendorsStrong communication (verbal & written) and presentation skills (English speaking is must)Understanding of business needs and customers’ requirement, able to participate in cross functional team environmentStrong project management skills to ensure execution to timelinesAbout Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations, please contactMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.