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STATS ChipPAC
Founded by : Choon Heung Lee, 1 January 1994
Singapore
More than 5000 employees
About the Company
STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Industry Type
According to the GICS (Global Industry Classification Standard) version of March 2023, STATS ChipPAC ’s industry classification falls within the following categories:
- Sector: Information Technology
- Industry group: Semiconductors & Semiconductor Equipment
- Industry: Semiconductors & Semiconductor Equipment
- Sub-Industry: Semiconductors
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Company Address
509 Yishun Industrial Park A, Singapore, SG
Source : Google maps