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STATS ChipPAC

Founded by : Choon Heung Lee, 1 January 1994

About the Company

STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

Industry Type

According to the GICS (Global Industry Classification Standard) version of March 2023, STATS ChipPAC ’s industry classification falls within the following categories:
  • Sector: Information Technology
  • Industry group: Semiconductors & Semiconductor Equipment
  • Industry: Semiconductors & Semiconductor Equipment
  • Sub-Industry: Semiconductors
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Company Address

509 Yishun Industrial Park A, Singapore, SG

Source : Google maps